High Deflection Gap Packing Tflex HD80000 Series Thermal Pad

Product Details
Customization: Available
Certification: RoHS, ISO9001
Type: Thermally Pad
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  • High Deflection Gap Packing Tflex HD80000 Series Thermal Pad
  • High Deflection Gap Packing Tflex HD80000 Series Thermal Pad
  • High Deflection Gap Packing Tflex HD80000 Series Thermal Pad
  • High Deflection Gap Packing Tflex HD80000 Series Thermal Pad
  • High Deflection Gap Packing Tflex HD80000 Series Thermal Pad
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Basic Info.

Model NO.
Tflex HD80000
Material
Thermally Pad
Form
Thermal Element
Shape
Sheet
Thermal Conductivity
6W
Color
Teal
Product Thickness
1.0~5.0mm
Temperature Range
-400ºC~ 1500ºC
Transport Package
Boxed
Specification
Customized Size
Trademark
Laird
Origin
USA
Production Capacity
5kk Pieces/Yearly

Product Description

 
   The High Deflection Gap Packing Tflex HD80000 Series thermal pad is a cutting-edge solution for thermal management in electronic devices. With its high deflection capability, this thermal pad is able to effectively fill gaps and provide optimal heat transfer between components. This ensures that electronic devices remain cool and perform at their best, even under heavy loads. The Tflex HD80000 Series is a reliable and efficient choice for engineers and designers looking to improve the thermal performance of their products. Its advanced design and high-quality materials make it a top choice for a wide range of applications.
High Deflection Gap Packing Tflex HD80000 Series Thermal Pad
High Deflection Gap Packing Tflex HD80000 Series Thermal Pad
High Deflection Gap Packing Tflex HD80000 Series Thermal Pad

 

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