Tpli™ 220 is a premium gap filler that offers exceptional thermal conductivity and performance. This unique blend of boron nitride and silicone creates the highest performing interface pad on the market. With Tpli™ 220, you can trust that your electronic components will be effectively cooled and protected from overheating. Whether you are working on a high-tech project or simply need reliable thermal management solutions, Tpli™ 220 is the ideal choice. Its superior properties make it a top contender in the industry, ensuring that your devices operate at optimal levels. Trust Tpli™ 220 for all your gap filling needs.